Back end of line

While the term front end of line (FEOL) refers to the first portion of any IC fabrication where the individual devices are patterned in the semiconductor, back end of line (BEOL) comprises the subsequent deposition of metal interconnect layers. Thus, BEOL is the second portion of IC fabrication process where the individual devices (transistors, capacitors, resistors, etc.) get interconnected with wiring by deposited metalization layers.

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